PCB Chat

PCB Chat

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
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Episode's summary

Wally Rhines is the spokesperson for the ESD Alliance, part of Semiconductor Equipment and Materials International. He joins Andy Shaughnessy every quarter to share details from the latest ESD Alliance report on sales of computer-aided engineering tools, semiconductor tools, PCB design software, related IP and services, and employment. In this interview, Wally discusses the results for Q2 2026. While much of the industry reported double-digit increases for the second quarter, the PCB/MCM sector marked a 15% drop in revenue. Is this a momentary blip on the radar?

Episodes

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PCB Chat 164: Wally Rhines on the Latest ECAD Market Data

Wally Rhines is the spokesperson for the ESD Alliance, part of Semiconductor Equipment and Materials International. He joins Andy Shaughnessy every quarter to share details from the latest ESD Alliance report on sales of computer-aided engineering tools, semiconductor tools, PCB design software, related IP and services, and employment. In this interview, Wally discusses the results for Q2 2026. While much of the industry reported double-digit increases for the second quarter, the PCB/MCM sector marked a 15% drop in revenue. Is this a momentary blip on the radar?

09 Nov 2026
520-

PCB Chat 163: Miroslava Velasco on the Value of Mentorship in PCB Design

In this episode of PCB Chat, Ryann Howard speaks with Miroslava Velasco, a senior designer and manager at Qualcomm, about her journey into electronics and PCB design, the mentors who shaped her career and her experiences at industry events like PCB West. From overcoming early underestimation to inspiring the next generation of women engineers, Miroslava reflects on the role models who encouraged her to succeed while staying true to herself.

19 Oct 2026
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PCB Chat 162: HDP User Group Annual Update With Madan Jagernauth

The High Density Packaging User Group recently released its Annual Progress Report. In this episode, Marketing Director Madan Jagernauth discusses the group's R&D activities over the past year, as well as the challenges facing designers and manufacturers working with today's extreme densities and the organization's future plans. He also shares a preview of several sessions that the group will present at PCB West 2026.

01 Sep 2026
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RM 199: Good Adhesive, Bad Bond: The Hidden Causes of Adhesion Failure

Adhesive failures can be frustrating because the problem isn’t always obvious. The adhesive may have been properly selected, the part may look clean, and the process may seem under control. But weeks or months later, a coating lifts, an encapsulant separates, or a bond fails in the field. So what went wrong?In this episode of Reliability Matters Mike Konrad is joined by David Dworak, material scientist at Dymax, to discuss the science behind reliable adhesion in electronics manufacturing.They talk about why adhesive bonding is about much more than choosing the right material. Dworak explains the role of adhesive chemistry, surface energy, wetting, contact angle measurement, surface preparation, plasma treatment, and why even a visually clean surface may not be ready for bonding.Also explored: how manufacturers can troubleshoot adhesion failures, control their bonding process, and gather objective evidence that a surface is truly ready for adhesive application.If your process involves conformal coatings,…

23 Aug 2026
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PCB Chat 161: Chris Parker Discusses Case Study on Dielectrics and Thermal Management

Thermal management is a “hot” topic right now, and with today’s rising power densities, thermal issues are moving into more mainstream PCB designs. If you’ve ever wondered whether you could squeeze another heat sink onto your board, you won’t want to miss this episode of PCB Chat. Chris Parker is the director of product engineering at TCLAD, a company that develops PCB materials designed for managing excessive heat. Today, Chris discusses a case study that TCLAD conducted with the Rochester Institute of Technology. Researchers built two electrically identical test boards – one constructed with standard FR-4, and one with TCLAD’s SFL-12 dielectric. As Chris explains, the choice of dielectric made a big difference in surface temperatures, with one power component running 26 degrees cooler on the board made with TCLAD material than on the FR-4 test board. He also walks us through what they learned from the use of thermal bridges.

18 Aug 2026